Scientific Programme 2010, ver.3
Tuesday, 2nd November
14:00 | Opening Session
K. Vojtěchovský, Z. Kašlík, TECON Scientific, Rožnov p. Radh. Czech Republic
|
14:05 | Silicon Usage in Semi & PV Applications
R.Winegarner, SAGE Concept, USA
|
14:50 | KUKA PV equipment – Market and Development
A.Vontz, KUKA Systems, Augsburg, Germany
|
15:20 - 15:30 | Coffee break
|
15:30 | Activities of Fraunhofer THM in Crystal Growth Sphere of Research
M. Zschorsch, Fraunhoffer THM, Germany
|
16:00 | Solar Grade Silicon : perspective for metallurgical refining
Y.Meteleva-Fischer, Mekelwerg, Felf, Belgium
|
16:20 | The characteristics of multicrystalline silicon received from metallurgical material
Irkutsk State University, Irkutsk, Russia
|
16:40 | ARNOLD Group – presentation
P.Weiner, S.Buchborn, Arnold, Germany
|
17:15 | Customized Wafer Line Concepts by KUKA
B.Richter, KUKA Systems, Augsburg, Germany
|
18:30 | Evening Programme - RELAX Hotel
|
Wednesday, 3rd November
9:00 | Study of technological and radiation defects in Silicon
V.Sopko, O.Semenko, Technical University, Prague, Czech Republic
|
9:25 | Formation of the Microdefects during Annealing in the Neutron Doping of Cz-Silicon
K.L.Enisherlova, V.T.Bublik et al.,Pulsar, Moscowe, Russia, Nat. University of Sc. and Technology “MISIS“, Moscow, Russia
|
9:45 | Requirements for cpmpensated SOG Si feedstock for use in crystalline solar cells
B.Sandberg, S.Grandum et al., Elkem Solar As, Norway
|
10:15 - 10:30 | Coffee Break
|
10:15 | Combined Investigation of Silicon-on-Insulator Structures
K.L.Enisherlova, A.V.Lutzau et al.,Pulsar, Moscowe, Russia, Moscow State Technical University „MADI“, Moscow, Russia periment H.J.Möller , T.Wagner, R.Rietzschel, C.Funke
|
10:55 | NIBAG New Ceramic Plate Technology
N.Bucher, N.Bucher AG, Switzerland
|
11:30 | Strainer structure of power vertical PNP transistors
V. Strakos, On semiconductor, Roznov p.Radh., Czech Republic
|
11:50 | Simulation of an ESD protection structure
R.Malousek, Corp. Res. and Dev., ON Semiconductor, Roznov p.R., Czech Republic
|
Wednesday, 3rd November
14:00 | Classification of recombination active defects in multicrystallineSolar cells made from upgraded metallurgical grade (umg) – silicon
D.Lausch, K.Petter et al., Fraunhoffer Center fur Silizium-Photovoltaic, Q-cells SE Process development-R&D Silicon, Germany
|
14:20 | Thin layers thermocouples
V.Sopko O.Semenko, Technical University Prague, Prague, Czech Republic
|
14:50 | Modern trends in the central frequency converters for photovoltaic applications – Co. Control Techniques
H.Prikryl, M.Blunar,ControlTechniques-Emerson,Brno, Czech Republic
|
15:00 - 15:15 | Coffee Break
|
15:15 | Limits of bond and grind back SOI technology
M. Lorenc, M. Pospisil, J.Sik, ON Semiconductor, Roznov p.Radh., Czech Republic
|
15:40 | Stress in thin films of polycrystalline silicon
D. Lysacek, ON Semiconductor, Roznov p. Radh., Czech Republic
|
16:05 | Ultrasonic cleaning devices for solar wafers producers
L.Miklanek, J.Urban, ULTRAZVUK s.r.o., Nove mesto nad Vahom, Slovak Republic
|
Thursday, 4th November
9:00 | Investigation of the removal process and subsurface damage after wire sawing
S.Kaminski, T.Wagner, et al., TU Bergakademie Freiberg, Germany
|
9:30 | Future cutting with diamond wire, welding of diamond wire
M.Haussman, Vision Lasertechnik, Germany
|
10:00 - 10:15 | Coffee Break
|
10:15 | Comparison of Slurry-based and Fixed Abrasive Wafering
U.Shoenholzer, Heltina CO., Switzerland
|
10:45 | Bekaert Sawing Wire Road Map
R. Moerkerke, Bekaert, Belgium
|
11:15 | Non-Contact Wafer Characteristic Measurements for Semiconductor and Photovoltaic wafer Manufacturing
N. Schroeder, MTI, USA
|
11:35 | Forward to the Future-New Types of Mounting Adhesives for Diamond Wire Saw and for Thinner Wafers
Y. Chu, Valtech Corp., USA
|
Thursday, 4th November
14:00 | Silicon mono-crystalline wafers grand with variol abrasive materials
H.Hiklova, M.Havelkova, Join Lab. Of Optics, Olomouc, Czech Republic
|
14:20 | MKU Carrier Fluids for the preparation of Slurries – Development and Tendency
H. Muller, E.Klapp, MKU Chemie GmbH., Germany
|
14:40 | Novel water Based Cutting Fluids for Saw Technology
Lapcik, L.Jr., K.Vojtechovsky, L.Lapcik , Bata University Zlin, Czech Republic
|
15:05 | Oxidation of Silicon surface and specific properties of silicon dioxide
L.Lapcik, K.Vojtechovsky,L.Lapcik, Jr. et all., Bata University Zlin, Czech Republic
|
15:40 | Advance wire saw machine AWSM 3800.6A – KUKA S-Base production
K.Vojtechovsky, KUKA S-Base s.r.o., Roznov p.Radh., Czech Republic
|
16:20 | ASQM2800.3 – Automatic squaring machine
K.Vojtechovsky, KUKA S-Base s.r.o., Roznov p.R., Czech Republic
|
17:10 - 18:00 | Demonstration AWSM 3800.6 and AWSM 4800.2s Wire Saw Machines
KUKA S-base s.r.o., K. Vojtěchovský, R.Kolacek, A.Vontz
|
18:30 | Evening Programme – Zavadilka
|
Friday, 5th November
9:00 | FEM simulation of thermal differences in semifished glass recess during the cooling
M. Havelkova, Join Lab AS of CZ, Olomouc, Czech Republic
|
9:15 | Conjugated Silicon – Based Polymer Reists for Nanotechnology
F.Schauer, T.Bata University Zlin, Zlin, Czech Republic
|
9:40 | MIR and NIR reflectance – an efficient tool to characterize SOI wafers
J.Humlicek, Institute of Condensed Matter Physics, Faculty of Science, Masaryk University, Brno, Czech Republic
|
10:00 - 10:15 | Coffee Break
|
10:15 | X-ray diffraction studies of oxide precipitates in Cz-silicon
O.Caha, Institute of Condensed Matter Physics, Faculty of Science, Masaryk University, Brno, Czech Republic
|
10:30 | Laser scanning confocal microscopy for 3D surface mapping
H.Lapsanska, Palacky University, Olomouc, Czech Republic
|
10:50 | Silicon monochromators for hard x-ray optics
P.Mikulik, Masaryk Univerzity Brno, Brno, Czech Republic
|
11:15 | 2D and 3D mapping of solid surfaces using a Form Talysurf Series 2 device
H.Hiklova, Joint Lab. Of Optics, Olomouc, Czech Republic
|
11:35 | Measurement of scattering properties of ultrathin glass mirrors
D.Madat et al., joint Lab. Of Optics, Olomouc, Czech Republic
|
11:45 | Near UV filter optical properties
M.Palatka et al., Joint Lab. Of Optics, Olomouc, Czech Republic
|
12:05 | Spectroscopic method for the laser welding quality control
H.Chmelickova, Joint Lab. Of Optics, Olomouc, Czech Republic
|
12:30 | Closing of the Conference
K.Vojtěchovský, Z.Kašlík, Tecon Scientific, Rožnov p.R., Czech Republic
|
Scientific programmes of previous conferences:
- scientific programme of Silicon 2008
- scientific programme of Silicon 2006
- scientific programme of Silicon 2004